Test In Assembly or TIA is a concept to perform open short test at the back end of assembly after wire bond.
Assembly must deliver parts free of any assembly issues for Final Test.
The idea is to use TIA to detect any assembly faults introduced during the assembly process.
Assembly faults includes wire bond issue such as open, short and cross bond, ESD failures , diode forward and reverse leakages etc.
Assembly department will be able to take immediate action to rectify problem.
All assembled parts leaving will be free of assembly issues.
Why do you need TIA?
Assembly has full control of their process and take full responsibility for their quality.
It is able to detect assembly issue in process.
Assembly normally ask Test Department to do OS Test for them. Assembly still would have to pay Final Test for this job.
It is cheaper to use dedicated OS testers than using an expensive Functional testers to do a simple Open Short test.
Assembly will know the results almost immediately rather than have to wait for Final Test to tell them. It will be too late to take any remedial action.
If you have any questions regarding our products and services, you can call us at (65) 6383 2221 or fill out the form below and we will get back to you.
